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Pca guide PCA DFM Guidelines Table of Contents Revision History References C Workmanship Standards Hierarchy of Documents Documentation Requirements Format Assembly Drawings PCB Fabrication Drawings Parts List Manufacturing Bill of Material Gerber Files C

PCA DFM Guidelines Table of Contents Revision History References C Workmanship Standards Hierarchy of Documents Documentation Requirements Format Assembly Drawings PCB Fabrication Drawings Parts List Manufacturing Bill of Material Gerber Files CAD Data Schematics and Test Speci ?cations Engineering Change Orders ECO ? s ECN ? s etc PCB Layout and Design References PCB Size PCB Thickness PCB Shape Layer Count and Construction Copper Weights Trace Widths Trace Spacings Drill Locating References Aspect Ratio Hole Tolerancing Annular Ring Pad Sizing C Standard Drill Sizes Soldermask Types Soldermask Clearances Soldermask Dams Via Masking Surface Finishes Silk-screened Legends Panelization Size and Shape Array Design Retention Methods Xouts Surface Mount Assembly PCB Size Shape Bow and Twist Board Panel Clearances SMT Panelization guidelines Breakaway rails Retention Method Fiducials De ?nition Global Panel Fiducials Block Fiducials C Local Fiducials Fiducial Mark Design Speci ?cations Component Placement Process Considerations Re ow Considerations Wave Solder Considerations Inspection Considerations Component Spacing Component Footprints Hierarchy of Pad Design References Fine Pitch Layout BGA Layout Vias Vias within the Component Land Pattern Vias Under Components Advanced Technologies Automated Through Hole Assembly Insertion Hole Locations Component Location Objectives Component Selection Lead Hole Diameter Considerations Location Considerations Axial Lead Component Insertion Lead Form and Tooling C Hole Diameter Requirements Component Body Con ?guration Location Considerations Above the Board Below the Board Uninsertable Area Clinch Patterns Clinch Length Clinch Repeatability DIP Component Insertion Component Input Speci ?cations Hole Diameter Considerations Component Lead Considerations Component Mix Location Considerations Above the Board Below the Board Uninsertable Area Clinch Patterns Press Fit Component Consideration Hole Size Component Clearances Wave Solder PCB Size C Clearances Component Orientation DIP Connectors Surface Mount Component Footprint Design Solder thieves Vias Pad Sizes Passive components Non-waveable Components Wave Solder Pallets Materials Form Factor Terminations BGA ? s Sealed Components Moisture Sensitive Components Appendix Listing Introduction The purpose of this document is to provide our customers with a set of guidelines that will allow them to design products that are both manufacturable and testable Assemblies that are designed for manufacturability and testability will be easier and faster to produce require less rework repair and generate less scrap All of which will result in a more cost e ?ective product for our customers These guidelines are based on industry standard speci ?cations Please note For maximum impact DFM reviews must be accomplished during the design stage when changes are easy and cost e ?ective References C ANSI J-STD- Requirements for Soldered Electrical and Electronic Assemblies IPC-T- Terms and De ?nitions for Interconnecting and Packaging Electronic Circuits IPC-D- Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies IPC-D- A Documentation Requirements for Printed Boards Assemblies and Support Drawings IPC-A- Acceptability of Electronic Assemblies IPC-R- Suggested Guidelines for Modi ?cation Rework and Repair of Printed Boards and Assemblies IPC-SM- Surface Mount Design and Land Pattern Standard IPC-SM- Procedures for Characterizing and Handling of Moisture Re ow Sensitive IC ? s Motorola Semiconductor Technology Data ?? PBGA AN Workmanship Standards All Electronic and