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Chassis Air Guide (CAG) Design Guide September 2003 Revision 1.1 R 2 INTEL CORP

Chassis Air Guide (CAG) Design Guide September 2003 Revision 1.1 R 2 INTEL CORPORATION (AND ANY CONTRIBUTOR) IS PROVIDING THIS INFORMATION AS A CONVENIENCE AND ACCORDINGLY MAKES NO WARRANTIES WITH REGARD TO THIS DOCUMENT OR PRODUCTS MADE IN CONFORMANCE WITH THIS DOCUMENT. THIS DOCUMENT IS PROVIDED "AS IS" AND INTEL DISCLAIMS ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTY OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE. IN ADDITION, INTEL (AND ANY CONTRIBUTOR) DOES NOT WARRANT OR REPRESENT THAT THIS DOCUMENT OR ANY PRODUCTS MADE IN CONFORMANCE WITH IT WILL OPERATE IN THE INTENDED MANNER, ARE FREE FROM ERRORS OR DEFECTS, OR ARE SAFE FOR USE FOR ITS INTENDED PURPOSE. ANY PERSON USING THIS DOCUMENT OR MAKING, USING, OR SELLING PRODUCTS IN CONFORMANCE WITH THIS DOCUMENT DOES SO AT HIS OR HER OWN RISK. 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Copyright © 2002, 2003 Intel Corporation 3 Contents 1 Introduction ......................................................................................................................... 6 1.1 Scope ..................................................................................................................... 6 1.2 Overview................................................................................................................. 6 1.3 Recommended Chassis for Chassis Air Guide...................................................... 7 1.4 Reference Documents............................................................................................ 7 2 Chassis Considerations ...................................................................................................... 8 2.1 Chassis Air Guide Description ............................................................................... 8 2.2 Chassis Air Guide Typical Airflow Pattern.............................................................. 9 2.3 Chassis Air Guide Assembly Stack...................................................................... 10 2.4 Separation Distance............................................................................................. 10 2.5 System Fans......................................................................................................... 11 2.6 CAG Venting Location.......................................................................................... 12 2.7 System Venting .................................................................................................... 13 2.8 Attach Mechanisms.............................................................................................. 13 3 Dynamics .......................................................................................................................... 14 3.1 Shock Test............................................................................................................ 14 3.2 Vibration Test ....................................................................................................... 14 3.3 Pass Criteria......................................................................................................... 14 4 Process Selection ............................................................................................................. 15 4.1 Vacuum Forming Process.................................................................................... 15 4.2 Injection Molding Process .................................................................................... 15 5 Regulatory Considerations................................................................................................ 16 5.1 Electromagnetic Interference Radiation............................................................... 16 5.2 Safety ................................................................................................................... 17 5.3 Ecology................................................................................................................. 17 6 Mechanical Drawings........................................................................................................ 18 6.1 Flange, Chassis Air Guide.................................................................................... 19 6.2 Upper Duct, Chassis Air Guide ............................................................................ 20 6.3 Lower Duct, Chassis Air Guide ............................................................................ 21 6.4 Duct Assembly, Chassis Air Guide ...................................................................... 22 6.5 Vent Pattern, Chassis Air Guide .......................................................................... 23 6.6 Chassis Air Guide Center Location...................................................................... 24 4 Figures Figure 1. Typical Tower Platform With Chassis Air Guide.................................................. 8 Figure 2. Chassis Air Guide Typical Airflow Pattern........................................................... 9 Figure 3. Chassis Air Guide Exploded View With Screws................................................ 10 Figure 4. Separation Distance From Active Fan Heatsink................................................ 11 Figure 5. Chassis Side Panel Venting .............................................................................. 12 Figure 6. Flange, Chassis Air Guide................................................................................. 19 Figure 7. Upper Duct, Chassis Air Guide.......................................................................... 20 Figure 8. Lower Duct, Chassis Air Guide.......................................................................... 21 Figure 9. Duct Assembly Chassis Air Guide..................................................................... 22 Figure 10. Vent Pattern, Chassis Air Guide...................................................................... 23 Figure 11. Chassis Air Guide Center Location ................................................................. 24 5 Revision History Revision Number Description Revision Date 1.0 Initial Release. May 2002 1.1 System vent pattern optimization September 2003 Introduction 6 1 Introduction 1.1 Scope This design guide explores the design, implementation and performance of a ducting solution to cool the internal components of a personal computer enclosure. Design recommendations are presented for implementation within a mid-tower desktop style enclosure. The target audiences for this document are: computer enclosure engineers, designers, and system integrators. 1.2 Overview The newest personal computer technologies, including those for processor, chipset, memory, and graphics, pose significant thermal challenges to the system designer. As the market transitions to faster computing speeds and enhanced features in reduced platform sizes, both the heat and heat density generated by these devices will continue to increase. Such increases in component-level power force the designer to reconsider the thermal solutions used at the chip, package, board and system-level. Active heatsinks have proven to be a reliable and relatively economical solution to keep pace with an increasingly challenging thermal environment. To continue using these heatsink technologies, consideration to the system-level thermal solution must be given. In the past, system designers focused on improving system thermal environments by adding fans and optimizing vent locations. This remains a very important aspect of system thermal design. However, the increasing costs and complexities of package-level thermal solutions requires more advanced system level technologies in order to find a more balanced and cost-effective approach for the system. If the computer enclosure can provide cooler internal temperatures much of this expense can be mitigated. With the proper balance of system and package solutions, the integrator can minimize the overall system cost. In an environment of increasing thermal loads, the processor is generally the most demanding component in terms of system thermal design. Processor thermal solutions commonly use a copper or aluminum heatsink with an active fan providing airflow. The processor die temperature can be directly correlated to the temperature of the air flowing into the active fan and heatsink. The lower the temperatures, the lower processor die temperature. Most computer enclosures typically provide an internal thermal environment of approximately 40-45 °C, at a 35 °C room temperature. This document provides a reference design of one solution to lower the processor thermal environment to approximately 38 °C. The reference design, or duct, is called the Chassis Air Guide (CAG). Version 1.1 of the Chassis Air Guide Design Guide includes information on a larger diameter upper duct and includes guidance on other system vents. The larger duct allows for more airflow demanded by active fan heatsinks. The balancing of vents that control the internal airflow is critical to satisfy the other subsystem thermal targets as well as processor ambient temperature. Version 1.1 provides a system level cooling approach. Introduction 7 1.3 Recommended Chassis for Chassis Air Guide This design guide refers to a chassis with the features listed below. However, the ingredients and design techniques described here could be adapted to other chassis: • Fits a standard ATX or microATX motherboard • Supports two external 5.25-inch peripheral bays, one external 3.5-inch peripheral bay and one or two internal 3.5-inch peripheral bays • Includes one standard PS/2-sized power supply or PS/3-size for smaller chassis • Includes up to seven add-in card slots including a graphics card • Does not use a single-piece chassis cover • Provides single system-fan cooling with provision for at least one 92-mm rear exhaust fan (Note that this statement excludes the fan in the Power Supply) • Internal power supply with fan exhausting system enclosure • Accommodates standard ATX I/O shield • Provides for front connector I/O compliant with the Front Panel I/O Connectivity Design Guide 1.4 Reference Documents Document Document No./Location ISO 7779-Acoustics–Measurement of Airborne Noise Emitted by Information Technology and Telecommunications Equipment http://www.iso.ch/ ATX Thermal Design Suggestions http://www.formfactors.org EMC Design Suggestions http://www.formfactors.org microATX Motherboard Interface Specification 1.0 http://www.formfactors.org ATX Motherboard Specification http://www.formfactors.org Performance microATX Thermal Design Suggestions v1.0 http://www.formfactors.org Chassis Considerations 8 2 Chassis Considerations 2.1 Chassis Air Guide Description The following design is intended to achieve a temperature rise (Trise) of less than 3 °C to standard ATX and microATX tower style chassis. The design focus is to lower the processor thermal environment temperature while allowing for some core (processor and chipset) area movement based on varying motherboard layout designs. The overall goal is to provide a cooling solution that can be easily integrated into current and future chassis designs while being adaptable for different motherboards at a minimum cost and integration impact. Figure 1 is a chassis that is similar to many microATX chassis platforms currently available. The three-piece Chassis Air Guide is shown attached to the chassis side panel. The Chassis Air Guide consists of a hollow tube with a flared end that guides cool room ambient air towards the processor. It has no fans and is therefore a completely passive cooling solution. It relies entirely on the internal systems fans to guide air to the processor and other system components. To properly function, it requires a ventilation opening on the chassis side panel. This is discussed further in Section 2.6. The design of the Chassis Air Guide limits the use of one-piece chassis top and side covers. A side panel as seen in Figure 1 is recommended for ease of installation. Figure 1. Typical Tower Platform With Chassis Air Guide Chassis Considerations 9 2.2 Chassis Air Guide Typical Airflow Pattern