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IEC 60947-7-4 Edition 2.0 2019-01 REDLINE VERSION Low-voltage switchgear and co

IEC 60947-7-4 Edition 2.0 2019-01 REDLINE VERSION Low-voltage switchgear and controlgear – Part 7-4: Ancillary equipment – PCB terminal blocks for copper conductors INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 29.130.20 ISBN 978-2-8322-6451-5 ® Registered trademark of the International Electrotechnical Commission ® Warning! Make sure that you obtained this publication from an authorized distributor. colour inside This is a preview - click here to buy the full publication – 2 – IEC 60947-7-4:2019 RLV  IEC 2019 CONTENTS FOREWORD ........................................................................................................................... 4 INTRODUCTION ..................................................................................................................... 6 1 Scope .............................................................................................................................. 7 2 Normative references ...................................................................................................... 7 3 Terms and definitions ...................................................................................................... 9 4 Classification ................................................................................................................. 10 5 Characteristics .............................................................................................................. 10 5.1 Summary of characteristics ................................................................................... 10 5.2 Type of PCB terminal block ................................................................................... 10 5.3 Rated and limiting values ...................................................................................... 11 5.3.1 Rated voltages .............................................................................................. 11 5.3.2 Rated current ................................................................................................. 11 5.3.3 Standard cross-sections ................................................................................ 11 5.3.4 Maximum cross-section ................................................................................. 12 5.3.5 Connecting capacity ...................................................................................... 12 6 Product information ....................................................................................................... 13 6.1 Marking ................................................................................................................. 13 6.2 Additional information ........................................................................................... 14 7 Normal service, mounting and transport conditions ........................................................ 14 8 Constructional and performance requirements ............................................................... 14 8.1 Constructional requirements ................................................................................. 14 8.1.1 Clamping units ............................................................................................... 14 8.1.2 Mounting and installation ............................................................................... 15 8.1.3 Clearances and creepage distances .............................................................. 15 8.1.4 Terminal identification and marking ............................................................... 15 8.1.5 Resistance to abnormal heat and fire ............................................................. 16 8.1.6 Maximum cross-section and connecting capacity ........................................... 16 8.2 Performance requirements .................................................................................... 16 8.2.1 Temperature-rise (current-temperature derating) ........................................... 16 8.2.2 Dielectric properties ....................................................................................... 16 8.2.3 Short-time withstand current .......................................................................... 16 8.2.4 Contact resistance ......................................................................................... 17 8.2.5 Ageing tests .................................................................................................. 17 8.3 Electromagnetic compatibility (EMC) ..................................................................... 17 9 Tests ............................................................................................................................. 17 9.1 Kinds of test .......................................................................................................... 17 9.2 General ................................................................................................................. 17 9.3 Verification of mechanical characteristics .............................................................. 18 9.3.1 General ......................................................................................................... 18 9.3.2 Attachment of the PCB terminal block on its support ...................................... 18 9.3.3 Vacant ........................................................................................................... 19 9.3.4 Verification of the maximum cross-section and connecting capacity ............... 19 9.3.5 Verification of maximum cross-section (special test with gauges) .................. 19 9.4 Verification of electrical characteristics ................................................................. 20 9.4.1 General ......................................................................................................... 20 This is a preview - click here to buy the full publication IEC 60947-7-4:2019 RLV  IEC 2019 – 3 – 9.4.2 Verification of clearances and creepage distances ......................................... 20 9.4.3 Dielectric tests ............................................................................................... 20 9.4.4 Verification of contact resistance ................................................................... 21 9.4.5 Temperature-rise test (current-temperature derating) .................................... 23 9.4.6 Short-time withstand current test ................................................................... 25 9.4.7 Ageing tests .................................................................................................. 26 9.5 Verification of thermal characteristics.................................................................... 30 9.6 Verification of EMC characteristics ........................................................................ 31 9.6.1 General ......................................................................................................... 31 9.6.2 Immunity ........................................................................................................ 31 9.6.3 Emission ........................................................................................................ 31 Annex A (informative) Structure of a PCB terminal block ...................................................... 32 Annex B (informative) Additional information to be specified between the manufacturer and the user ......................................................................................................................... 33 B.1 Additional information available on request of the user ......................................... 33 B.2 Information for testing in addition to those mentioned above ................................. 33 Annex C (informative) Examples of PCBs and PCB terminal blocks for high-current application ............................................................................................................................ 34 C.1 Layout of high-current PCBs (schematic diagram) ................................................. 34 C.2 High-current PCB terminal blocks ......................................................................... 35 Bibliography .......................................................................................................................... 36 Figure 1 – Test assembly for the measurement of contact resistance and temperature-rise .. 23 Figure 2 – Example of wiring structure of a multi-tier PCB terminal block .............................. 24 Figure 3 – Test assembly for the measurement of short-time withstand current .................... 26 Figure 4 – Test sequence ..................................................................................................... 27 Figure 5 – Test sequence for PCB terminal blocks with contact pressure via insulating material ................................................................................................................................ 28 Figure 6 – Current cycling ageing test procedure .................................................................. 30 Figure A.1 – Structure of a PCB terminal block ..................................................................... 32 Figure C.1 – Structure of a high current PCB ........................................................................ 34 Figure C.2 – PCB terminal block with soldered connection to the PCB .................................. 35 Figure C.3 – PCB terminal block with screwed connection to the PCB .................................. 35 Table 1 – Standard cross-sections of copper conductors ...................................................... 12 Table 2 – Relationship between maximum cross-section and connecting capacity of PCB terminal blocks.............................................................................................................. 13 Table 3 – Standards for clamping units and connecting methods .......................................... 14 Table 4 – Tightening torques for PCB terminal blocks with screw-type clamping units ........... 19 Table 5 – Impulse withstand test voltages ............................................................................. 21 Table 6 – Dielectric test voltages corresponding to the rated insulation voltage .................... 21 Table 7 – Length of connectable conductors and conductor loops ......................................... 24 Table 8 – Examples of cross-sectional distribution of interconnections on printed circuit boards ........................................................................................................................ 25 This is a preview - click here to buy the full publication – 4 – IEC 60947-7-4:2019 RLV  IEC 2019 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________ LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR – Part 7-4: Ancillary equipment – PCB terminal blocks for copper conductors FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. DISCLAIMER This Redline version is not an official Standard and is intended to provide the user with an indication of what changes have been made to the previous version. Only the IEC International Standard provided in this package is to be considered the official Standard. This Redline version provides you with a quick and easy way to compare all the changes between this standard and its previous edition. A vertical bar appears in the margin wherever a change has been made. Additions are in green text, deletions are in strikethrough red text. This is a preview - click here to buy the full publication IEC 60947-7-4:2019 RLV  IEC 2019 – 5 – International Standard IEC 60947-7-4 has been prepared by subcommittee 121A: Low-voltage switchgear and controlgear, of IEC technical committee 121: Switchgear and controlgear and their assemblies for low voltage. This second edition cancels and replaces the first edition published in 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) additional test for PCB terminal blocks with clamping units, where contact pressure is transmitted through insulating materials; b) tightening torques for screws now given in Table 4 of this document (previously given in Table 4 of IEC 60947-1:2007); tightening torques added for an additional type of screw; c) new criteria for verification of contact resistance introduced; d) clarification in the description of the temperature-rise test (current-temperature derating); corrections in the test sequence according to Figure 4. The text of this International Standard is based on the following uploads/s1/iec-60947-7-4-2019-pdf.pdf